Electron Devices and Circuits: Unit III: (b) MOSFET Amplifier

Internal Capacitances of MOSFET and High Frequency Model

• Gate capacitance : It is a parallel-plate capacitance formed by a gate electrode with the channel, with the oxide layer acts as a capacitor dielectric. It is denoted as Cox.

Internal Capacitances of MOSFET and High Frequency Model

• High frequency response of MOSFET affects due to internal capacitances.

• There are two types of internal capacitances in the MOSFET :

• Gate capacitance : It is a parallel-plate capacitance formed by a gate electrode with the channel, with the oxide layer acts as a capacitor dielectric. It is denoted as Cox.

• Junction capacitances (Source-body and drain-body depletion layer capacitances) : These capacitances are due to the reverse-biased pn junctions formed by the n + source region and the p-type substrate, and the n + drain region and the p-type substrate. These are denoted as source diffusion capacitance and drain diffusion capacitance, respectively.

 

1. Gate Capacitances

There are three gate capacitances : Cgs, Cgd and Cgb"

Values of gate capacitances

• In triode region, the channel has uniform depth and hence we have

Cgs, = Cgd  = 1/2 WL Cox   (Triode region)

• In saturation region, the channel has a tapered shape and is pinched off at or near the drain. Therefore, we have


• In cut-off region, the channel disappears and thus

Cgs, = Cgd  = D (cut-off)

However, gate-body model capacitance is given by

Cgb = W Lov Cox (cut-off)

• Due to the fact that the source and drain diffusions extend slightly under the gate oxide we need to add the capacitive component (Cov) to the Cgs and Cgd in the above formulas. The component Cov is known as overlap capacitance and is given by

Cov =  W Lov Cox

where Lov is the overlap length and is typically 0.05 L to 0.1 L. 

 

2. Junction Capacitances

• Source diffusion capacitance is given by


where Csb0 is the value of Csb at zero body-source bias, VSB is the magnitude of the reverse-bias voltage, and V0 is the junction built-in voltage, typically 0.6 V to 0.8 V.

• Similarly, drain diffusion capacitance is given by


 

3. High-Frequency MOSFET Model

• Fig. 7.6.1 shows the high frequency equivalent circuit model for MOSFET. In this model, capacitance Cdb can be neglected to simplify the analysis. The resulted model is shown in Fig. 7.6.1 (b).


 

4. Unity-Gain Frequency (fT)

• The fT is the frequency at which the short-circuit current gain of the CS MOSFET amplifier becomes unity.

• Fig. 7.6.2 shows the modified high-frequency equivalent circuit to determine the short-circuit current gain. Here, the input is fed with a current-source signal Ii and the output terminals are shorted.


• The short circuit current Io is given by

Io = gm Vgs – s Cgd Vgs

• The second term in the above equation is very small and can be neglected at the frequencies of interest and thus

Io = gm Vgs   ... (7.6.3)

• The Vgs m terms of Ii can be given by

Vgs = Ii / s (Cgs Vgd )  ...(7.6.4)

• Substituting the values of Ii and Io from equations (7.6.3) and (7.6.4) we have


• For physical frequencies S = j rn From equation (7.6.5) it can be seen that the magnitude of the current becomes unity at the frequency.


• From equation (7.6.7) we can say that fT is proportional to gm and inversely proportional to the internal capacitances.


Ex. 7.6.1 For n-channel MOSFET, L = 1.0 µm Lgv = 0.05 µm W=10µm Cox =3.45 × 10-3 F / m2, ID = 200 µA and Kn = 150 µA/ V2. Find the fT if MOSFET is operating in the triode region.

Sol. : Cox = 3.45 × 10-3 F/m2


 

Electron Devices and Circuits: Unit III: (b) MOSFET Amplifier : Tag: : - Internal Capacitances of MOSFET and High Frequency Model