types with their abbrevations, diagram
Subject and UNIT: Linear Integrated Circuits: Unit I: IC Fabrication
The wafer is cut off along the lines drawn using the sharp diamond tipped tool. Thus individual chips are separated from each other. Then each chip is assembled on a suitable package.
different techniques with diagram | IC Fabrication
Subject and UNIT: Linear Integrated Circuits: Unit I: IC Fabrication
Metallization is a process in which a thin layer of metal is formed which is used to make interconnections between the components on the chip as well as interconnections between the components and the outside world.
different techniques with diagram
Subject and UNIT: Linear Integrated Circuits: Unit I: IC Fabrication
We have studied that on a single silicon wafer, large number of components are fabricated. So it is important to provide isolation between these components electrically. The most commonly used isolation techniques are,
techniques with diagram
Subject and UNIT: Linear Integrated Circuits: Unit I: IC Fabrication
As we know, the conductivity of the semiconductor increases when small impurity is added to it. The process of adding impurity is called doping while the impurity to be added is called dopant.
Subject and UNIT: Linear Integrated Circuits: Unit I: IC Fabrication
The process of doping i.e. adding impurity to the silicon wafer is called diffusion. Diffusion is used to form bases, emitters and resistors in bipolar device technology and to form source and drain regions in MOS device technology.
different techniques with diagram
Subject and UNIT: Linear Integrated Circuits: Unit I: IC Fabrication
To produce extreamly small circuits and to develop patterns on the silicon wafer, the process adopted is called photolithgraphy.
different techniques with diagram
Subject and UNIT: Linear Integrated Circuits: Unit I: IC Fabrication
The process in which a thin layer of silicon dioxide (SiO2) formed on a surface of silicon wafer using thermal growth technique is called oxidation
two main processes, chemical reaction, types, advantages, disadvantages
Subject and UNIT: Linear Integrated Circuits: Unit I: IC Fabrication
The epitaxy means 'arranged upon'. In epitaxy a monocrystalline film is formed on the top of a monocrystalline surface. Thus epitaxy is crystalline growth process in which the foundation layer i.e. substrate works as seed crystal.
IC Fabrication
Subject and UNIT: Linear Integrated Circuits: Unit I: IC Fabrication
The first important process in IC fabrication is the formation of a silicon wafer through the crystal growth. This process can be subdivided into number of sub processes as given below.
Subject and UNIT: Linear Integrated Circuits: Unit I: IC Fabrication
The word 'monolithic' is originated from Greek word and means 'single stone' or 'one stone'. Thus this word is appropriate as the components are integrated on a single piece of silicon crystal.
Subject and UNIT: Linear Integrated Circuits: Unit I: IC Fabrication
In 1947, Prof. Bardeen and Prof. Brattain, the members of a research group at Bell Laboratories, invented first germanium transistor. Actually the team was attempting to make a device resembling a field effect transistor.
Subject and UNIT: Linear Integrated Circuits: Unit I: IC Fabrication
Depending upon the functional utility, the integrated circuits are classified as linear ICs and digital ICs. From the point of view of structural considerations, ICs can be divided as monolithic ICs, thick-thin film ICs and hybrid ICs.