University Questions with Answers (Long Answered Questions)

University Questions with Answers (Long Answered Questions)

(Regulation 2008)

Dec.-11                

Q.1 Explain the process of epitaxial growth in IC fabrication process with neat diagrams. [Section 1.6]                            [8]

Q.2 Describe in detail about the diffusion process of IC fabrication. [Section 1.9] [8]

Q.3 Write a note on isolation technique used in ICs. [Section 1.11]   [8]

Q.4 Discuss the different ways to fabricate diodes. [Section 1.14]      [8]

May-12

Q.5    Explain in detail the fabrication process of passive component in integrated circuits.          [Section 1.14]                          [16]

Q.6 With necessary diagrams explain the fabrication of MOSFET. [Section 1.14 [16]

Dec.-12

Q.7 Explain the fabrication of n-channel JFET with necessary diagrams. [Section 1.14]          [16]

Q.8 Explain the basic processes used in the fabrication of monolithics IC. [Section 1.15]          [16]

May-13

Q.9 Explain the process of epitaxial growth in IC fabrication process with neat diagrams. [Section 1.6]         [8]

Q.10 With neat sketches describe the various types of integrated resistors. [Section 1.14]         [8]

May-14

Q.11 Explain the importance of isolation and discuss the different methods of isolation. [Section 1.11] [6]

Q.12 How a PN junction diode is formed in IC fabrication ? [Section 1.14]        [16]

(Regulation 2013)

Dec.-14

Q.13 Explain the process of masking and photoetching in IC fabrication. [Section 1.8] [7]

Q.14 Discuss the different ways to fabricate diodes. [Section 1.14]    [10]

Q.15 Explain how a monolithic capacitor can be fabricated. [Section 1.14]         [6]

May.-15

Q.16 Describe the epitaxial growth process. [Section 1.6]        [8]

Q.17 Explain the different types of IC packages. [Section 1.13]         [8]

Q.18 Briefly explain the various process involved in fabrication monolithic IC which integrates diode capacitance and FET. [Section 1.15]          [16]

Dec.-15

Q.19 What is thin and thick film technology ? Explain various methods used for deposition of thin film technology. [Section 1.14]   [16]

Q.20 Explain the various steps involved in fabrication of a typical transistor into monolithic ICs. [Section 1.15]       [16]

May-16

Q.21 Distinguish diffusion and ion Implantation process in IC fabrication.

[Refer sections 1.9, 1.10]        [6]

Q.22 Describe the metallization process, assembly processing and packaging with neat diagram.

[Refer sections 1.12.2, 1.13]   [10]

Q.23 Discuss briefly about the PN junction diode and JFET fabrication.

[Refer sections 1.14.2, 1.14.6]          [16]

Dec.-16

Q.24 Describe about epitaxial growth process.

[Refer section 1.6]         [6]

Q.25 Explain in detail about the Photolithography process with neat diagram.

[Refer section 1.8]         [7]

Q.26 Write a note on masking and etching process in IC fabrication.

[Refer section 1.8.3] [13]

Q.27 What are the new trends in Integrated circuit technologies and explain about its scope for future generation ?

[Refer sections 1.1, 1.2] [15]

Q.28 Write a note on recent fabrication methods of FET for industrial applications.

[Refer section 1.14.6]    [15]

May-17

Q.29 With neat illustrations explain the various steps involved in the IC fabrication process.

[Refer section 1.15]       [13]

Q.30 With circuit diagram explain the steps involved in the fabrication of the circuit shown below using IC technology.

(Refer section 1.15)       [13]

Q.31  Explain the basic process used in silicon planar technology with neat diagram.

 [Refer section 1.14]      [13]

Q.32  Write a note on classification of IC and IC packages.

[Refer sections 1.2 and 1.13]  [13]

Q.33  What are the new trends in integrated circuit technologies and explain about its scope for future generation.

[Refer section 1.14]       [15]

Q.34  Explain in detail the recent fabrication methods of diode and capacitance for industrial applications.

[Refer section 1.15]       [15]

May-18

Q.35  Describe the steps involved in the fabrication of monolithic IC transistors.

[Refer section 1.15]       [13]

Q. 36 Elaborate the fabrication of MOS ICs th suitable diagram.

[Refer section 1.14] [13]

Q.37 What are the new trends in Integrated circuit technologies and explain about its scope for future generation ?

[Refer section 1.14]       [15]

Q.38 Write a note on recent fabrication methods of diode and capacitance for industrial applications.

[Refer section 1.15]       [15]

 Note : All the examples asked in the previous university papers are solved and included in the chapter.